PI Film Polyimide Film

PI film, also known as polyimide film, is made of pyromellitic dianhydride and diaminodiphenyl ether condensed into a film in a strong polar solvent, and then imidized. It has excellent heat resistance, high tensile strength, good chemical stability, good radiation resistance and good dielectric properties.

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1. Insulation materials: insulation for motors and nuclear power equipment, high-temperature resistant wires and cables, electromagnetic wires, high-temperature resistant wires, high-temperature resistant pressure-sensitive tapes, insulating composite materials, etc.

2. Semiconductor and microelectronics industry: passivation layer and buffer inner coating of microelectronic devices, interlayer dielectric materials of multi-layer metal interconnect circuits, and important base materials for optoelectronic printed circuit boards.

3. Electronic label field: printed circuit board motherboards, corrosion products, mobile phones, lithium batteries and other products.


Product modelTechnicl Parameters P68025 P68050 P68075 P6810 P68125
color dark brown dark brown dark brown dark brown dark brown
Total thickness[mm] 0.025 0.05 0.075 0.1 0.125
Tensile Strength[Mpa](MD/TD) ≥165/148 ≥165/148 ≥165/148 ≥165/148 ≥165/148
Elongation at break[%](MD/TD) ≥50/52 ≥50/52 ≥50/52 ≥50/52 ≥50/52
Shrinkage[%](150℃,MD/TD) ≤1/1 ≤1/1 ≤1/1 ≤1/1 ≤1/1
Shrinkage(380℃,MD/TD) ≤3/3 ≤3/3 ≤3/3 ≤3/3 ≤3/3
surface resistivity[Ω] ≥1010 ≥1010 ≥1010 ≥1010 ≥1010


Specification data

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