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PI film, also known as polyimide film, is made of pyromellitic dianhydride and diaminodiphenyl ether condensed into a film in a strong polar solvent, and then imidized. It has excellent heat resistance, high tensile strength, good chemical stability, good radiation resistance and good dielectric properties.
1. Insulation materials: insulation for motors and nuclear power equipment, high-temperature resistant wires and cables, electromagnetic wires, high-temperature resistant wires, high-temperature resistant pressure-sensitive tapes, insulating composite materials, etc.
2. Semiconductor and microelectronics industry: passivation layer and buffer inner coating of microelectronic devices, interlayer dielectric materials of multi-layer metal interconnect circuits, and important base materials for optoelectronic printed circuit boards.
3. Electronic label field: printed circuit board motherboards, corrosion products, mobile phones, lithium batteries and other products.
| Product modelTechnicl Parameters | P68025 | P68050 | P68075 | P6810 | P68125 |
| color | dark brown | dark brown | dark brown | dark brown | dark brown |
| Total thickness[mm] | 0.025 | 0.05 | 0.075 | 0.1 | 0.125 |
| Tensile Strength[Mpa]（MD/TD） | ≥165/148 | ≥165/148 | ≥165/148 | ≥165/148 | ≥165/148 |
| Elongation at break[%]（MD/TD） | ≥50/52 | ≥50/52 | ≥50/52 | ≥50/52 | ≥50/52 |
| Shrinkage[%]（150℃，MD/TD） | ≤1/1 | ≤1/1 | ≤1/1 | ≤1/1 | ≤1/1 |
| Shrinkage（380℃，MD/TD） | ≤3/3 | ≤3/3 | ≤3/3 | ≤3/3 | ≤3/3 |
| surface resistivity[Ω] | ≥1010 | ≥1010 | ≥1010 | ≥1010 | ≥1010 |
Specification data
